Third International Workshop on
Cross-layer Resiliency (IWCR 2015)
Munich, July 20-21, 2015

Program (under construction):

You can find the program here

The following industrial presentations are currently confirmed:

  • Dr. Andreas von Schwerin, Siemens, "Resiliency aspects of industrial control systems"
    Abstract:
    Safety, and thus reliability and robustness are of key importance for industrial electronic systems, which control manufacturing in highly automated factories. Advanced semiconductor technology nodes are known to be more susceptible to soft errors or reliability hazards like electromigration or other wear-out mechanisms. Nevertheless, ASICs and other microelectronic components used in industrial automation systems are based on advanced microelectronic technology, mostly due to limited availability of key components or interface IP in legacy nodes. On the other hand, due to 24/7 operation also under harsh temperature conditions, the mission profile for systems in an industrial environment is much more demanding than for hand-held consumer devices and still significantly more demanding than for automotive electronics, whereas the safety requirements are comparable to the latter application domain. Therefore, reliability concerns in industrial control systems are even more severe than for automotive. In consequence, quality and reliability requirements for semiconductor technology and microelectronic components used in industrial automation are very high and strictly applied by the industry. But there is also a growing need for innovative approaches in design and verification to cope with possible intrinsic failures of microelectronic circuits and to make sure that built-in safety measures in hardware and software can guarantee safe operation of the industrial systems at any time.
  • Joachim Fröschl, BMW Group, Prof. Dr.-Ing. Hans-Georg Herzog, TUM, Energy Conversion Technology, "Cybernetic aspects of a design for resiliency"
    Abstract:
    This paper gives a short discussion about cybernetic aspects of a system design for resiliency in technical management systems. The discussion bases on automotive system design and covers as an example the energy management system.
    The complexity of energy and power management, the tolerances of components and system signals, and additionally the improvement of the design during a long time within the development process characterize an automotive power supply. The challenge is how to design a stable system which can deal with these facts.
    As a first research result, a cybernetic approach seems to be a useful way of solution. Starting with a power supply hardware system, the management system design follows the proposed principle of equi-structural design which is explained in this paper. In combination with the system model of the flexible energy and power management (fEPM) a model based management system was developed. The cybernetic principles of autonomy, abstraction, ultrastability, and a variety leveling design of the operating strategy are basically necessary for resiliency.
    In summary, the science of cybernetics offers a powerful method to design resilient management systems with more than one system layer.
  • Dr. Harald Gossner, Intel Mobile Communications, "Early ESD Soft Fail Characterization and its Application to Final System Design"
    Abstract:
    Electrostatic discharge (ESD) is a critical reliability risk both during manufacturing of ICs as well as at end customer operation of electronic systems. While on IC level only hard fails due to damages occur, on system level so-called soft fails are dominating which lead to temporary malfunction of the system without causing physical damage.
    In the system design phase these weaknesses are addressed by system ESD stress tests according to IEC 61000-4-2. This test is defined as qualification procedure of the finalized system. The critical aspect is, that uncovering weaknesses in such a late phase of the system design regularly results in unpredicted delays and costly work-around. Characterizing soft fail sensitivity of exposed IC pins on early verification boards is crucial to mitigate this problem.
    A concept of pulse stressing on system verification board level has been developed recently. However, the challenge remains to relate these results to the final system behavior with different form factor and firmware/software. New modelling and simulation approaches have to be developed to make this methodology useful for practical designs. Such a new modeling approach would immediately allow to optimize the soft fail robustness across the layers of PCB design,chassis design, firmware and software.
  • Maik Herzog, Infineon Technologies, "Requirement driven physical verification of automotive power IC’s"
    Abstract:
    Electronics are playing an expanding role in automotive platforms. Their application is no longer tied to traditional systems such as airbag controllers or engine control but also expanding rapidly into advanced driver assistance systems.
    Reliable design of robust semiconductors for such systems, fulfilling functional safety requirements and including compliance to industry standards like ISO 26262, became a critical success factor in this market. Meeting such standards a couple of activities and solutions turned out to be important:
    1) the need for a traceable flow of requirements through different hierarchy levels of the automotive electronic systems down to the physical implementation level;
    2) capture and manage all design intent in a rigorous way;
    3) advanced verification tool functionality to prove the correct implementation of the captured requirements and design intent.